AI Chip Interconnect Breakthrough: Eliyan Secures $60 Million Funding to Accelerate Chiplet Technology for AI Chips

• Eliyan secures $60 million funding for advancing chiplet interconnects accelerating AI chips
• Funding led by Samsung Catalyst Fund and Tiger Global Management, with participation from existing investors
• NuLink PHY technology offers significant performance improvements and power efficiency for chip makers in the AI industry
• Universal Memory Interface (UMI) addresses memory capacity and bandwidth challenges in AI chips
• Eliyan well-positioned to drive innovation in AI chips with chiplet interconnect technology and revolutionize chiplet-based systems

Eliyan Secures $60 Million Funding

Eliyan, a company specializing in chiplet interconnect technology, has recently made waves in the tech industry by securing a substantial $60 million in funding. This funding injection is set to propel Eliyan’s innovative solution for accelerating AI chips to new heights. The funding round was spearheaded by Samsung Catalyst Fund and Tiger Global Management, with notable participation from existing investors like Intel Capital, SK Hynix, Cleveland Avenue, and Mesh Ventures.

The demand for AI chips is on a rapid upward trajectory, and Eliyan’s chiplet interconnect technology is strategically positioned to tackle the challenges associated with developing cutting-edge AI chips. Market forecasts predict a significant surge in the high-bandwidth memory (HBM) sector, with an anticipated 331% increase this year and a further 124% surge by 2025, according to research conducted by Arete Research.

Revolutionizing AI Chips with NuLink PHY

Eliyan’s chiplet interconnect technology, NuLink PHY, stands out from the crowd by offering remarkable performance enhancements and power efficiency compared to existing solutions. This innovative technology boasts up to four times the performance capabilities while consuming only half the power, making it an incredibly enticing option for chip manufacturers operating within the AI industry.

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NuLink PHY is designed to be compatible with both advanced and standard packaging materials, effectively addressing memory and IO wall constraints. By allowing chip makers to connect multiple chiplets on a single device, NuLink PHY paves the way for enhanced performance and improved power efficiency in AI chip designs. The technology’s ability to achieve high performance levels while maintaining low power consumption is a game-changer in the industry.

Addressing Memory Challenges with Universal Memory Interface (UMI)

In addition to its NuLink PHY chiplet interconnect technology, Eliyan is tackling the critical issue of memory capacity and bandwidth in AI chips with its Universal Memory Interface (UMI). This bi-directional interconnect method is specifically crafted to overcome the “memory wall” challenge commonly encountered in large multi-die designs. UMI offers a bandwidth-efficient connection to memory and can be seamlessly integrated into both standard organic substrates and advanced packaging solutions.

With the backing of the recent funding secured by Eliyan, the company is poised to further its focus on designing and manufacturing advanced AI chips utilizing multi-die architectures. Already demonstrating commercial readiness with tape outs in cutting-edge processes, Eliyan’s chiplet interconnect technology showcases high bandwidth, low latency, and impressive power efficiency capabilities, effectively addressing crucial industry challenges.

Driving Innovation in AI Chip Design

The success of Eliyan’s recent funding round underscores the confidence in the company’s approach to chiplet connectivity technology and its potential to revolutionize chiplet-based systems. As the demand for enhanced connectivity solutions driven by AI continues to rise, coupled with the industry-wide shift towards multi-die implementations in the semiconductor sector, Eliyan is well-positioned to play a pivotal role in the chiplet revolution.

Overall, Eliyan’s chiplet interconnect technology holds immense promise for the AI industry, offering a trifecta of benefits including improved performance, enhanced power efficiency, and increased memory capacity. With the recent funding injection fueling its advancements, Eliyan is primed to continue pushing the boundaries of innovation in the realm of AI chips, ultimately shaping the future landscape of chiplet-based systems.